Diamond dresser

Electroplated Pad conditioning dresser for semiconductor polishing pad

This wheel is used for dressing/conditioning the polishing pads used in the flattening process of semiconductor devices. Electroplated the appropriate abrasive grains of the selected diamond to a base metal brings stable dressing/conditioning, and results in reduced individual differences.

Work materials: Urethan pad, Non-woven fabric pad, Suede pad, which are semiconductor polishing pad

Bonding: Electroplated

Specification
*Outer Diameter: ~740D(29B)
*Base accuracy: Flatness 0.3 Set tolerance 0.05
*Base materials: SUS304, SUS420
*Base coating: With or without Teflon coating
*Electroplated surface: one side or both side
*Abrasive grain: Diamond (Blocky type)
*Particle size: #60 ~ 400